Nitride AlN Substrate Laser Slag Removal
Aluminum Nitride substrates, may they be as fired, lapped, or polished, when lasered, will have unwanted laser slag which must be removed prior to metalizing.
This Laser Slag, on microelectronic substrates, needs to be removed because the loose material will cause reliability problems with fine-line microcircuitry.
VDC has developed a proprietary process for laser slag removal and edge rounding, chamfering, deburring, and blending on substrate edges, cutouts, and lasered holes. This process is adaptable to most materials including 99.6% Alumina substrates, Fused Silica, Quartz, Glass and various other hard and semi-hard substrate, windows and wafer materials.
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