Nitride AlN Substrate Laser Slag Removal
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Advanced Search Powered by KSearch 1.5b Nitride AlN Substrate Laser Slag RemovalAluminum Nitride substrates, may they be as fired, lapped, or polished, when lasered, will have unwanted laser slag which must be removed prior to metalizing. This Laser Slag, on microelectronic substrates, needs to be removed because the loose material will cause reliability problems with fine-line microcircuitry.
VDC has developed a proprietary
process for laser slag removal and edge rounding, chamfering, deburring, and
blending on substrate edges, cutouts, and lasered holes. This process is adaptable
to most materials including 99.6% Alumina substrates, Fused Silica, Quartz,
Glass and various other hard and semi-hard substrate, windows and wafer materials.
For more information on:
Aluminum Nitride as-fired, lapped, or polished substrates
from stock
or custom made, go to
http://www.aluminumnitride.com
Return to Home Page: Laser hole and edge rounding, chamfering and blending Updated: 16 Jan 2009 |
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