Laser Drilled Ceramic Substrates

Laser Drilled Ceramic Substrates

Laser drilled holes in substrates of Aluminum Nitride and Aluminum Oxide have slag which occurs when the substrate material is melted by the laser beam.

Techniques used for slag removal are:

• Tumbling
• Abrasive Blasting
• Abrasive Vibratory
• Scraping
• Chemical Etching
• Manual
• Combination of several mentioned above

We have experience with all techniques mentioned and have developed new processes which eliminate damage to the substrate surface with special emphases to laser drilled holes and slots in Aluminum Nitride substrates.

Aluminum Nitride information links:

• www.quartz-silica.net/aluminum-nitride Chemical analysis for Aluminum Nitride Ceramics
• www.customdicing.com/aln-links Aluminum Nitride information
• www.customdicing.com/aluminum-nitride Aluminum Nitride advantages
• www.edgepolishing.com/aluminum-nitride AlN physical and electrical properties
• www.aluminumnitride.com/polished Polished AlN substrates
• www.valleydesign.com/substrate Aluminum Nitride substrates

Return to Home Page: Laser hole and edge rounding, chamfering and blending

Updated: 19 October 2010

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